Ingenic Semiconductor Stock Update – 23 November 2026
Price and Volume
Closing price: CNY 105.4 (flat, 0 % change).
Shares outstanding: 519.6 million.
Market capitalization: CNY 52.4 billion.
24‑hour turnover: CNY 1.9 billion.
Trading volume in the last 24 hours: CNY 1.9 billion.
Historical Performance
Share price has declined 31.35 % since the end of last month.
200‑day simple moving average: CNY 153.22.
52‑week high: CNY 279.44 (1 July 2026).
52‑week low: CNY 76.5 (24 November 2025).
Recent Corporate Actions
Ingenic Semiconductor Co. has reported continued strong demand for its logic and storage fabrication operations amid tightening supply in the semiconductor market.
The company announced price increases for logic wafers and DRAM, citing sustained growth in artificial‑intelligence (AI) servers, automotive power‑management chips, and industrial control devices.
Management highlighted increased capacity utilization and the pursuit of long‑term supply agreements to secure pricing through 2027.
In storage, niche DRAM and NAND products remain at premium pricing levels due to persistent scarcity and higher‑end‑use requirements.
The firm plans to expand its 3D AI‑focused foundry capabilities and integrate new process technologies to serve the growing AI and automotive sectors.
Peer Activity (Last 24 Hours)
Stock Change Current Price Market Cap Notes Sangfor (300454.SZ) 0 % CNY 146.74 CNY 57.6 bn Earnings rise in Q3; revenue growth; expansion in network security and AI solutions. China Eastern Airlines –H (0670.HK) –2.99 % HKD 2.31 HKD 69.2 bn Announced “Eastern Ease‑Journey” platform; digital enhancements such as quick‑check‑in and intelligent app agent. Shanghai Biren –H (6082.HK) –10.56 % HKD 23.7 HKD 68.8 bn Significant decline; market capitalization unchanged. Nanya New Material Technol (688519.SS) 0 % CNY 244.1 CNY 61.3 bn P/E ratio 110.32. SG Micro (300661.SZ) 0 % CNY 88.08 CNY 59.9 bn P/E ratio 76.6; share price fell 12.3 % after reporting a 12.3 % drop in earnings; sector volatility noted. Company Profile
Name: Ingenic Semiconductor Co., Ltd.
Business Model: Fabless technology company focused on embedded CPU products for mobile and consumer SoC applications.
Products: Solutions for wearables, smart IoT, smart video, and CPU technology for biometrics, e‑education, portable media players, e‑readers, and mobile Internet devices.
Founded: 2005.
Headquarters: Beijing, China.
Listing: Shenzhen Stock Exchange (symbol 300223.SZ).
IPO Date: 31 May 2011.
Website: www.ingenic.cn
This report summarizes the latest trading activity, market metrics, recent corporate developments, and peer performance relevant to Ingenic Semiconductor.